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Main Business

Special coating

Coating is an essential process to stabilize process conditions and extend lifetime through special coating treatment on the surface of equipment parts.
By providing a wide range of various coating technologies optimized for each customer's process, particles and surface damage can be controlled and by stabilizing the conditions of the chamber, the life time of the product, the production yield and the operation rate can be improved, also contributing to the cost reduction of the customer.

Types of coating technology

  • Anodized
    coating
    Anodized coating

    Technology for forming a solid aluminum oxide film (Al2O3) on the surface of aluminum through electrochemical reaction between aluminum (Al) and oxygen (O)

  • Thermal Spray
    Coating
    Thermal Spray Coating

    Technology of melting a coating material through heat and spraying it on the surface of parts to form a coating film

    Atmospheric Plasma Spray Coating (APS)

    The material to coat is instantaneously melted and sprayed using a high-temperature plasma under atmospheric conditions to form a coating film on the surface of products

    Generally suitable for ceramic powder coating

    Arc spray coating (Arc)

    Technology to instantly melt and spray the coating materials with low melting point by using electric discharge in order to form the film on the surface of products

    Suitable for metal coatings with low melting point

  • Aerosol
    deposition
    Aerosol deposition

    Technology of forming a high-density coating film without pores by colliding fine powders of ㎚ to ㎛ size to the surface of products under vacuum at very high speed without any melting process

Main coating technology

Coating technology can be classified according to how to coat and its physical properties. In order to cope with a next-generation technology handing less than 10 nm, KoMiCo is developing various and unique coating technology.

Ceramic coating

Category APS AD APS + AD
Y203 FineCera™ SF™ NOVA™ HDS2™
Purpose of Use Particle generation control and process stabilization by adding plasma resistance properties of semiconductor parts Plasma resistance improvement and particle generation control by surface densification
Key Features Excellent plasma resistance Controlling particle generation by process reaction Controlling process changes by minimizing reaction between process gas and coating layer Minimizing particle generation Controlling particle generation
Hardness(Hv) 400 ~ 450 300 ~ 350 350 ~ 450 - 550 ~ 650
Volumetric Resistance (Ωcm) E+11~12 E+10~11 E+10~11 >E+13 >E+13
Porosity (%) 3 ~ 5 < 2 < 3 Near Zero Near Zero
Cross-section
Technology introduction video

Metal coating

Category ARC
ARC SurfTex-1 SurfTex-2
Purpose of use The adhesion enhancement between basic materials and arc coating surface to improve particle control effect.
Key Features To stabilize byproducts and induce deposition To control particles and peeling-off effect. To extend P.M cycle due to contaminant deposition. increased through pattern formation
Adhesion(Mpa) 15 ~ 18 > 27 -
Bare comparison
Increasing rate of surface area (%)
2% - 12%
Image
Technology introduction video

Anodizing

Category Anodizing
Sulfuric acid method Aquatic method
Purpose of use Addition of insulation properties of semiconductor parts, protection of appearance
Key Features Excellent hardness and insulation properties Excellent corrosion resistance
Hardness (Hv) 400~500 350~400
Volumetric resistance (Ωcm) E+9 ~ 10 E+9 ~ 10
Image
Technology introduction video

Image with coating

  • TEL SCCM VIGUS 300mm

  • AMAT PRODUCER-e

  • VARIAN (Si Coating)

  • TEL SCCM SHIN 300mm

  • AMAT DPS2 300mm